Surface Mount Technology
We are equipped with 2 Contact Systems, 1 MYDATA Pick, Place machines with placement
rate of the 10,500 cph each and the ability to place any component – fine-pitch, BGAs, QFPs,
chip scale BGAs, CSPs, flip chips, and 0201s. 7 zone reflow oven capable of lead free solderind.

Through Hole and Mixed Technology
We are equipped with 7 CS-400 Cut & Clinch semi-automatic insertion machine.
Lead forming equipment and lead free wave solder.